Electronic component supply apparatus and method of processing component supply tape in electronic component supply apparatus

ABSTRACT

An electronic component supply apparatus transports a component supply tape having accommodation sections in which electronic components are accommodated and that supplies each of the electronic components accommodated in each of the accommodation sections to a component mounting apparatus. The electronic component supply apparatus includes a component depletion determining unit that determines that the electronic components are depleted in the component supply tape when a determination result of a component presence/absence determining unit is “absence” or determination results of the component presence/absence determining unit are “absence” a plurality of consecutive times; and a tape discharge processing unit that causes a component supply tape transport unit to transport the depleted component supply tape to a discharge port after a final component is picked up at a component picking-up position after the component depletion determining unit determines component depletion.

CROSS-REFERENCES TO RELATED APPLICATION(S)

This application is based on and claims priority from Japanese PatentApplication No. 2015-001165 filed on Jan. 6, 2015 and Japanese PatentApplication No. 2015-002000 filed on Jan. 8, 2015, the entire contentsof which are incorporated herein by reference.

BACKGROUND

1. Field of the Invention

One or more embodiments of the present invention relate to an electroniccomponent supply apparatus that transports a component supply tapehaving an accommodation section in which an electronic component isaccommodated and that supplies the electronic component to a componentmounting apparatus and a method of processing an electronic componenttape in the electronic component supply apparatus.

2. Description of Related Art

As an electronic component supply apparatus of a component mountingapparatus that mounts an electronic component on a substrate, a tapefeeder that supplies electronic components in a mode of a componentsupply tape having a pocket-like accommodation section, in which theelectronic component is accommodated, is widely used. The componentsupply tape is set to a state of being wound and accommodated on a reeland having a predetermined length, and a mounting head of the componentmounting apparatus picks up the electronic component from the componentsupply tape transported to a component picking-up position by the tapefeeder. Then, when the component supply tape accommodated on one reel iscompletely unwound, reel replacement is performed, in which a new reelis set and the next component supply tape is additionally supplied.

In the reel replacement, discharging a preceding component supply tape,from which the final component is picked up, that is, “empty tapedischarge”, or sending the leading component of a subsequently suppliedcomponent supply tape to the component picking-up position, that is,“heading of component”, is performed by an operator. In order to enhanceoperation efficiency through significant laborsaving in such reelreplacement, various measures have been taken in the related art (seePatent Document 1, for instance). Patent Document 1 discloses a relatedart, as an example, in which, after a terminal end portion of apreceding component supply tape is detected, whether or not anelectronic component is present in an accommodation section (pocket) ofthe component supply tape is detected in response to a suction nozzle ofa mounting head performing or not performing suction of a component and,when it is determined that there is no electronic component from thedetection result, the preceding depleted component supply tape israpidly discharged from the tape feeder.

Patent Document 1 is JP-A-2014-11291.

SUMMARY

However, the above-described related art has difficulties as follows.That is, in the related art, component detection required to determine atiming to discharge the depleted component supply tape through fastwinding is performed in response to the suction nozzle performing or notperforming suction of a component. When an empty accommodation sectionis detected predetermined consecutive times, component depletion in thecomponent supply tape is determined. Hence, there is a need torepeatedly perform the component suction operation which causes themounting head to lift and lower the suction nozzle from and to emptyaccommodation sections and thus, time is unavoidably wasted. Thus, thecomponent detection by the suction nozzle has difficulties in detectionaccuracy in that the presence or absence of the component is notcompletely detected in a reliable manner. In such the related art, it isdifficult to perform efficient and reliable detection of the presence orabsence of an electronic component in the accommodation section of thecomponent supply tape and, as a result, it is difficult to avoid wastingtime in the “empty tape discharge” during the reel replacement. Hence,improvement of productivity is impeded.

One or more embodiments of the present invention aim to provide anelectronic component supply apparatus which is able to perform rapiddischarge of the depleted component supply tape after electroniccomponents are picked up to improve productivity and a method ofprocessing an electronic component tape in the electronic componentsupply apparatus.

According to an aspect of the embodiments, there is provided anelectronic component supply apparatus that transports a component supplytape having a plurality of accommodation sections in which electroniccomponents are accommodated and that supplies each of the electroniccomponents accommodated in each of the accommodation sections to acomponent mounting apparatus, the electronic component supply apparatusincluding: a main body unit which is provided with a transport path thatguides the component supply tape from an insertion port, into which thecomponent supply tape is inserted, to a discharge port, through whichthe component supply tape is discharged; a component supply tapetransport unit that transports the component supply tape insertedthrough the insertion port toward the discharge port, and positions theaccommodation section at the component picking-up position on anupstream side from the discharge port; an electronic component detectingunit that detects the electronic component accommodated in theaccommodation section on the upstream side from the component picking-upposition on the transport path; a component presence/absence determiningunit that determines presence or absence of the electronic component inthe accommodation section based on information from the electroniccomponent detecting unit; a component depletion determining unit thatdetermines that the electronic components are depleted in the componentsupply tape when a determination result of the componentpresence/absence determining unit is “absence” or determination resultsof the component presence/absence determining unit are “absence” aplurality of consecutive times; and a tape discharge processing unitthat causes the component supply tape transport unit to transport thedepleted component supply tape to the discharge port after a finalcomponent is picked up at the component picking-up position after thecomponent depletion determining unit determines component depletion.

According to another aspect of the embodiments, there is provided anelectronic component supply apparatus that transports a component supplytape having a plurality of accommodation sections in which electroniccomponents are accommodated and that supplies each of the electroniccomponents accommodated in each of the accommodation sections to acomponent mounting apparatus, the electronic component supply apparatusincluding: a main body unit which is provided with a transport path thatguides the component supply tape from an insertion port, into which thecomponent supply tape is inserted, to a discharge port, through whichthe component supply tape is discharged; an inserted tape feeding unitthat transports the component supply tape transported along thetransport path toward the discharge port along the transport path; acomponent supply tape transport unit that transports by pitch thecomponent supply tape inserted through the insertion port toward thedischarge port, and positions the accommodation section at the componentpicking-up position on an upstream side from the discharge port; anelectronic component detecting unit that detects the electroniccomponent accommodated in the accommodation section on the upstream sidefrom the component picking-up position on the transport path; componentpresence/absence determining unit that determines presence or absence ofthe electronic component in the accommodation section based oninformation from the electronic component detecting unit; componentdepletion determining unit that determines that the electroniccomponents are depleted in the component supply tape when adetermination result of the component presence/absence determining unitis “absence” or determination results of the component presence/absencedetermining unit are “absence” a plurality of consecutive times; a tapedischarge processing unit that causes the component supply tapetransport unit to transport the depleted component supply tape to thedischarge port through continuous feeding transport after a finalcomponent is picked up at the component picking-up position after thecomponent depletion determining unit determines component depletion; anda subsequent-tape delivery unit that causes the inserted tape feedingunit to transport a subsequent component supply tape on the transportpath and that delivers a leading end portion of the subsequent componentsupply tape to the component supply tape transport unit.

According to still another aspect of the embodiments, there is provideda method of processing a component supply tape in an electroniccomponent supply apparatus that inserts, through an insertion port of atransport path, a component supply tape having a plurality ofaccommodation sections in which electronic components are accommodated,that transports the component supply tape along the transport path to acomponent picking-up position provided on the transport path, and thatsupplies each of the electronic component accommodated in each of theaccommodation sections to a component mounting apparatus, the methodincluding: sequentially positioning the accommodation sections at thecomponent picking-up position by a component supply tape transport unit;detecting a final electronic component on an upstream side from thecomponent picking-up position on the transport path; notifying thecomponent mounting apparatus that the final electronic component isdetected; receiving, from the component mounting apparatus, anotification that the final electronic component is picked up; anddischarging the depleted component supply tape by the component supplytape transport unit when the notification is received from the componentmounting apparatus.

According to still another aspect of the embodiments, there is provideda method of processing a component supply tape in an electroniccomponent supply apparatus that inserts, through an insertion port of atransport path, a component supply tape having a plurality ofaccommodation sections in which electronic components are accommodated,that transports the component supply tape along the transport path to acomponent picking-up position provided on the transport path, and thatsupplies each of the electronic components accommodated in each of theaccommodation sections to a component mounting apparatus, the methodincluding: sequentially positioning the accommodation sections at thecomponent picking-up position by a component supply tape transport unit;detecting passing of a terminal end portion of the component supply tapeon an upstream side from the component picking-up position on thetransport path; detecting a final electronic component on the transportpath after the passing detection; notifying the component mountingapparatus that the final electronic component is detected; receiving,from the component mounting apparatus, a notification that the finalelectronic component is picked up; and discharging the depletedcomponent supply tape by the component supply tape transport unit whenthe notification is received from the component mounting apparatus,wherein, in the discharging of the depleted component supply tape, thecomponent supply tape transport unit is driven until feeding amounts bythe component supply tape transport unit are accumulated to become apredetermined feeding amount after the passing detection.

According to still another aspect of the embodiments, there is provideda method of processing a component supply tape in an electroniccomponent supply apparatus that inserts, through an insertion port of atransport path, a component supply tape having a plurality ofaccommodation sections in which electronic components are accommodated,that transports the component supply tape along the transport path to acomponent picking-up position provided on the transport path, and thatsupplies each of the electronic components accommodated in each of theaccommodation sections to a component mounting apparatus, the methodincluding: sequentially positioning the accommodation sections at thecomponent picking-up position by a component supply tape transport unit;detecting a final electronic component on the transport path,particularly, on the upstream side from the component picking-upposition on the transport path; notifying the component mountingapparatus that the final electronic component is detected; receiving,from the component mounting apparatus, a notification that the finalelectronic component is picked up; discharging the depleted componentsupply tape by the component supply tape transport unit when thenotification is received from the component mounting apparatus; anddetecting passing of a terminal end portion of the component supply tapein the discharging of the depleted component supply tape, wherein, inthe discharging of the depleted component supply tape, the componentsupply tape transport unit is driven until feeding amounts by thecomponent supply tape transport unit are accumulated to become apredetermined feeding amount after the passing detection.

According to the embodiments, it is possible to perform rapid dischargeof a depleted component supply tape after electronic components arepicked up to improve productivity.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an explanatory diagram illustrating a configuration of anelectronic component supply apparatus of an embodiment of the presentinvention.

FIGS. 2A to 2C are explanatory diagrams illustrating configurations ofcomponent supply tapes as supply targets of the electronic componentsupply apparatus of the embodiment of the present invention.

FIGS. 3A and 3B are explanatory diagrams for illustrating aconfiguration of a sensor unit used in the electronic component supplyapparatus of the embodiment of the present invention.

FIGS. 4A and 4B are explanatory diagrams illustrating output waveformsof the sensor unit used in the electronic component supply apparatus ofthe embodiment of the present invention.

FIG. 5 is an explanatory diagram illustrating output forms of acomponent detecting sensor and a sprocket hole detecting sensor in thesensor unit used in the electronic component supply apparatus of theembodiment of the present invention.

FIG. 6 is an explanatory diagram illustrating component presence/absencedetection by the sensor unit used in the electronic component supplyapparatus of the embodiment of the present invention.

FIG. 7 is a block diagram illustrating a control processing function ofthe electronic component supply apparatus of the embodiment of thepresent invention.

FIG. 8 is an explanatory diagram illustrating a tape transport operationin the electronic component supply apparatus of the embodiment of thepresent invention.

FIG. 9 is an explanatory diagram illustrating the tape transportoperation in the electronic component supply apparatus of the embodimentof the present invention.

DETAILED DESCRIPTION

Next, an embodiment of the present invention will be described withreference to the drawings. First, a configuration of a tape feeder 1 asan electronic component supply apparatus will be described withreference to FIG. 1. The tape feeder 1 has functions of transporting acomponent supply tape 20 (refer to FIGS. 2A to 2C) having accommodationsections in which electronic components are accommodated, to a componentpicking-up position, and of supplying the electronic componentsaccommodated in the accommodation sections to a component mountingapparatus.

As illustrated in FIG. 1, the tape feeder 1 is configured to include amain body unit 1 a and a mounting section 1 b provided to protrudedownward from an undersurface of the main body unit 1 a. In a state inwhich the undersurface of the main body unit 1 a is mounted along afeeder base of the component mounting apparatus (not illustrated), thetape feeder 1 is fixed to and mounted on the feeder base, and aninternal controller 15 for controlling tape feeding in the tape feeder 1is connected to an apparatus controller (not illustrated) of thecomponent mounting apparatus. An operation/display panel 16 connected tothe controller 15 is provided on the top surface of the main body unit 1a and enables operational input or display required for operation orstate display of the tape feeder 1 to be performed.

A transport path 2 that guides the component supply tape 20 insertedinto the tape feeder 1 is provided inside the main body unit 1 a. Thetransport path 2 is provided to communicate between an insertion port 2a which is opened at an end portion of the tape feeder 1 on an upstreamside (left side in FIG. 1) in a tape feeding direction and through whichthe component supply tape 20 is inserted, and a discharge port 2 b whichis opened at an end portion on a downstream side and through which thecomponent supply tape 20 is discharged.

A feeding sprocket 3 is disposed on the upstream side of the transportpath 2 in the vicinity of the insertion port 2 a. The feeding sprocket 3is mounted, through a one-way clutch mechanism, on a drive shaft 4 whichis driven by a feeding motor 3M (refer to FIG. 7). A feeding sprocketsensor 3 a is provided at a joining portion between the feeding sprocket3 and the drive shaft 4 and is configured to include an encoder whichdetects that the component supply tape 20 inserted through the insertionport 2 a engages with the feeding sprocket 3. The feeding sprocketsensor 3 a detects the engagement of the component supply tape 20 withthe feeding sprocket 3 and thereby, the feeding motor 3M starts driving.In this manner, the component supply tape 20 is transported to thedownstream side, that is, toward the discharge port 2 b along thetransport path 2.

In the tape feeding of the component supply tape 20 by the feedingsprocket 3, the feeding sprocket 3 is joined to the drive shaft 4through the one-way clutch mechanism. The one-way clutch mechanismallows the drive shaft 4 of the feeding sprocket 3 to only rotate in adirection relative to the tape feeding direction. In this manner, adrive force transmitted from the drive shaft 4 to the feeding sprocket 3is limited to rotation in the tape feeding direction. In addition, sincethe feeding sprocket 3 is freely rotatable in the tape feeding directionregardless of the rotation of the drive shaft 4, the component supplytape 20 engaging with the feeding sprocket 3 moves in the tape feedingdirection with no impediment. In the configuration described above, thefeeding sprocket 3 driven by the feeding motor 3M functions as aninserted tape feeding unit that transports the component supply tape 20inserted through the insertion port 2 a toward the discharge port 2 balong the transport path 2.

A following-tape detecting sensor 8 and a following-tape stopper 9 aredisposed on the downstream side of the transport path 2 from the feedingsprocket 3. In a state in which the tape feeding of a precedingcomponent supply tape 20 (hereinafter, described as a preceding tape 20(1)) fed as a component picking-up target is continuously performed, thefollowing-tape stopper 9 has a function of causing a leading end portionof a following component supply tape 20 (hereinafter, described as afollowing tape 20 (2)) additionally inserted through the insertion port2 a to come into contact with the following-tape stopper 9 and to stopthe following tape 20 (2). The following-tape detecting sensor 8 detectsthat the following tape 20 (2) stopped in contact with thefollowing-tape stopper 9 is present.

An intermediate sensor 10 is disposed on the downstream side on thetransport path 2 from the following-tape stopper 9, and a sensor unit 11is disposed further on the downstream side from the intermediate sensor10. The intermediate sensor 10 corresponds to a tape detecting sensorand detects shapes regularly formed on the component supply tape 20 ofend portions of the component supply tape 20, that is, a terminal endportion of the preceding tape 20 (1) and a leading end portion of thefollowing tape 20 (2), further, an accommodation section 21 a, asprocket hole 21 b, or the like, substantially at an intermediateposition of the transport path 2 and thereby the intermediate sensor 10detects that the component supply tape 20 is present or has passedthrough. As the tape detecting sensor, a sensor other than theintermediate sensor 10 may be disposed on the transport path 2 as longas the sensor has a function of detecting the component supply tape 20.

The sensor unit 11 detects the presence or absence of an electroniccomponent Pin the accommodation section 21 a (refer to FIGS. 2A and 2B)of the component supply tape 20 having the following configuration.Here, with reference to FIGS. 2A and 2B, the configuration of thecomponent supply tape 20 is described. As illustrated in FIG. 2A andFIG. 2B, the component supply tape 20 has a base paper tape 21 as a mainbody, in which the accommodation sections 21 a for accommodating theelectronic components P and sprocket holes 21 b for tape feeding areformed at regular intervals. Here, two accommodation sections 21 a areformed, for example, in one pitch of the sprocket hole 21 b.

A cover tape 22 and a bottom tape 23 adhere to the top surface and theundersurface of the base tape 21, respectively, within a range in whichthe accommodation sections 21 a are formed such that the electroniccomponents P accommodated in the accommodation sections 21 a areprevented from dropping out. Before the electronic component P is pickedup out of the component supply tape 20, the cover tape 22 is peeled offfrom the base tape 21. That is, the target component supply tape 20according to the present embodiment is configured to have a plurality ofaccommodation sections 21 a in which the electronic components P areaccommodated and the sprocket holes 21 b formed at regular intervals andto accommodate the electronic components P in the accommodation sections21 a and to cover the electronic components P with the cover tape 22.

Both the cover tape 22 and the bottom tape 23 are optically transparentsuch that light radiating from below the bottom tape 23 is transmissibleto the upper side through a space inside the accommodation section 21 aand the cover tape 22. In the tape feeder 1 of the present embodiment,the light radiating from below the bottom tape 23 is received on theupper side of the cover tape 22 such that the presence or absence of theelectronic component P in the accommodation section 21 a is detected.

A component supply tape 20A illustrated in FIG. 2C corresponds to anembossed type tape used to supply relatively large-sized electroniccomponents. Embossed sections 21AE, in which each of the accommodationsections 21 a inside which each of the electronic components P can beaccommodated, are formed, are provided in a base tape 21A. In thecomponent supply tape 20A, the cover tape 22 also adheres to the topsurface thereof within a range in which the accommodation sections 21 aare formed. Both the base tape 21A and the cover tape 22 are opticallytransparent or an opening is provided in the bottom of the embossedsection 21AE such that light radiating from below the base tape 21A istransmittable to the upper side through the space inside theaccommodation section 21 a and the cover tape 22.

A transport sprocket mechanism 7 is provided on the downstream side ofthe sensor unit 11 and is configured to cause a transport motor 7M(refer to FIG. 7) as the same drive source to drive a first sprocket 5and a second sprocket 6. The component supply tape 20 is insertedthrough the insertion port 2 a and is fed along the transport path 2 bythe feeding sprocket 3 and the leading end portion of the tape reachesthe transport sprocket mechanism 7. Then, the component supply tape 20engages with the first sprocket 5 and the second sprocket 6 to befurther fed to the downstream side and is transported to a componentpicking-up position 14 set on the upstream side from the discharge port2 b. A cover member 12 covers the upper side of the transport sprocketmechanism 7 and a cover-tape processing unit 13 is disposed on a backsurface of the cover member 12.

A peeling claw of the cover-tape processing unit 13 peels off the covertape 22 or a cutting blade cuts open the cover tape 22, on the upstreamside of the component picking-up position 14, from the component supplytape 20 which is fed by the transport sprocket mechanism 7, thereby theelectronic component P accommodated in the accommodation section 21 a isexposed. In this manner, it is possible to pick up the electroniccomponent P by a mounting head (not illustrated) provided in thecomponent mounting apparatus, from the accommodation section 21 a fed tothe component picking-up position 14. That is, the cover-tape processingunit 13 has functions of peeling off or cutting open the cover tape 22of the component supply tape 20 which has yet to reach the componentpicking-up position 14 and of exposing the electronic component Paccommodated in the accommodation section 21 a.

In the configuration described above, the transport sprocket mechanism 7corresponds to a component supply tape transport unit that transportsthe component supply tape 20 transported along the transport path 2,toward the discharge port 2 b and positions the accommodation section 21a at the component picking-up position 14 on the upstream side from thedischarge port 2 b. Then, the feeding sprocket 3 as the inserted tapefeeding unit and the transport sprocket mechanism 7 as the componentsupply tape transport unit configure a component supply tape transportunit that transports the component supply tape 20 inserted through theinsertion port 2 a toward the discharge port 2 b and positions theaccommodation section 21 a at the component picking-up position 14 onthe upstream side from the discharge port 2 b. The feeding sprocket 3and the transport sprocket mechanism 7 can perform both continuoustransport in which the component supply tape 20 is continuously fed andpitch transport in which the component supply tape 20 is intermittentlyfed, as necessary.

In the configuration described above, as the component supply tapetransport unit, both the feeding sprocket 3 which corresponds to theinserted tape feeding unit and the transport sprocket mechanism 7 whichcorresponds to the component supply tape transport unit are included, asan example; however, the feeding sprocket 3 which corresponds to theinserted tape feeding unit is not necessarily required and only thetransport sprocket mechanism 7 may perform the transport of thecomponent supply tape 20. In this case, whenever a tape reel in whichthe component supply tape 20 is wound and accommodated is replaced, anoperation of setting the component supply tape 20 in the tape feeder 1or a splicing operation of splicing a tail end portion of thepre-mounted component supply tape 20 to the leading portion of thecomponent supply tape 20 which is newly supplied is performed.

Next, with reference to FIGS. 3A and 3B, a configuration and a functionof the sensor unit 11 will be described. Sections (A) and (B) in FIG. 3Aillustrate a side view and a sectional view of the sensor unit 11,respectively, in a tape transport direction (refer to an arrow a). Asillustrated in FIG. 3A, the sensor unit 11 is configured to join alight-emitting section 11 b and a sensor section 11 c on the lowersection and an upper section of a plate-shaped unit base 11 a,respectively, which is disposed in a vertical orientation. Attachmentportions 26 protrude from side surfaces of the unit base 11 a andattachment holes 26 a are provided in the attachment sections 26 suchthat the sensor unit 11 is fixed to the main body unit 1 a through theattachment sections 26 by inserting fixing bolts (not illustrated)through the attachment holes 26 a and fastening the bolts to the framesection of the main body unit 1 a. In this manner, the sensor unit 11 isfixed to the main body unit 1 a through the attachment sections 26. Thecomponent supply tape 20 as a detecting target is fed through betweenthe top surface of the light-emitting section 11 b and the undersurfaceof the sensor section 11 c.

A light source 25 mounted to be fixed through a light-source mountingsection 25 a is disposed on the light-emitting section 11 b, in anorientation in which a light-emitting direction is set toward the upperside. The sensor section 11 c is irradiated with detecting light byturning on the light source 25. In the sensor section 11 c, a componentdetecting sensor 28 a and a sprocket hole detecting sensor 28 b aredisposed corresponding to positions of the accommodation section 21 aand the sprocket hole 21 b on the component supply tape 20 as thedetecting target. Further, an aperture section 27 is mounted on theundersurface of the sensor section 11 c and has a second hole 27 a and afirst hole 27 b which are provided corresponding to positions of thecomponent detecting sensor 28 a and the sprocket hole detecting sensor28 b. As described above, since the cover tape 22 and the bottom tape 23which adhere to the top and underside surfaces of the component supplytape 20 are optically transparent, inspection light radiating upward byturning on the light source 25 is transmitted through the accommodationsection 21 a and the sprocket hole 21 b and is emitted to the upperside. Then, the inspection light is focused through the second hole 27 aand the first hole 27 b and is received at the component detectingsensor 28 a and the sprocket hole detecting sensor 28 b.

FIG. 3B illustrates a positional relationship between a position of thecomponent detecting sensor 28 a and the second hole 27 a and a positionof the sprocket hole detecting sensor 28 b and the first hole 27 b inthe tape feeding direction. That is, the first hole 27 b and thesprocket hole detecting sensor 28 b positioned for detection of thesprocket hole 21 b as the detecting target are disposed toward theupstream side (left side in FIG. 3B) by a predetermined offset dimensionD in the tape feeding direction (an arrow b) from the componentdetecting sensor 28 a and the second hole 27 a positioned for detectionof the presence or absence of the electronic component P as thedetecting target in the accommodation section 21 a.

Here, with reference to FIGS. 4A and 4B, a description is provided aboutdetection waveforms output by the component detecting sensor 28 a andthe sprocket hole detecting sensor 28 b which receive the detectionlight radiating from the light source 25. FIGS. 4A and 4B illustrate thedetection waveforms obtained when the accommodation section 21 a and thesprocket hole 21 b are the detecting targets, respectively. In FIGS. 4Aand 4B, arrows depicted to penetrate through the component supply tape20 represent inspection light which radiates from the light source 25and transmits through the component supply tape 20.

First, sections (A) and (B) in FIG. 4A represent detection waveforms ina case where the electronic component P is present in the accommodationsection 21 a. The section (A) in FIG. 4A represents a detection waveformWa in a case where there are gaps 21 a 1 and 21 a 2 on both sides of theelectronic component Pin the accommodation section 21 a and inspectionlight transmits upward through the gaps 21 a 1 and 21 a 2 and isreceived by the component detecting sensor 28 a. In this case, wheneverthe gaps 21 a 1 and 21 a 2 pass below the component detecting sensor 28a, the inspection light is received by the component detecting sensor 28a and two peaks Wa1 and Wa2 having sizes in accordance with a degree ofthe received light are acquired as the detection waveform Wa.

In addition, as illustrated in the section (B) in FIG. 4A, in a casewhere the electronic component P is positioned on one side in theaccommodation section 21 a and a gap 21 a 3 through which the inspectionlight is transmittable is present only on one side, the inspection lightis received by the component detecting sensor 28 a whenever the gap 21 a3 passes below the component detecting sensor 28 a and a detectionwaveform Wb formed of one peak having a size in accordance with a degreeof the received light is acquired.

As illustrated in a section (C) in FIG. 4A, in a case where noelectronic component P is positioned in the accommodation section 21 a,the inspection light that has been transmitted through the entire rangeof the component detecting sensor 28 a is received by the componentdetecting sensor 28 a and one detection waveform Wc having a size inaccordance with a light-receiving amount is acquired. The detectionwaveform Wc is characterized by a waveform width and a peak valuegreater than the detection waveforms Wa and Wb. Therefore, when thedetection waveform corresponds to the detection waveforms Wa and Wb, theelectronic component P is present in the accommodation section 21 a andthe detection waveform corresponds to the detection waveform Wc, theelectronic component P is not present in the accommodation section 21 a.Although omitted in the drawings, the detection waveform having almostno peak may be acquired in a case where the electronic component P ispresent. This case means that the size of the accommodation section 21 ahas small margin with respect to the size of the electronic component Pand almost no gap through which the inspection light is transmittable isformed.

Further, FIG. 4B illustrates a detection waveform Wd acquired when thesprocket hole 21 b passes the position of the sprocket hole detectingsensor 28 b. In this case, since the light radiated from the lightsource 25 is received by the component detecting sensor 28 a as theinspection light which has transmitted through the entire range of thesprocket hole 21 b, the detection waveforms Wd having a great waveformwidth and peak value are acquired at intervals corresponding to a holepitches of the sprocket holes 21 b and a tape feeding speed. Anevaluation parameter (a waveform width, a peak value, an integratedvalue, or the like) found from the acquired detection waveforms W iscompared to a preset threshold value and thereby, it is possible todetect the presence or absence of the electronic component P in theaccommodation section 21 a as the detecting target and the passing ofthe sprocket hole 21 b.

In the configuration described above, the light source 25, the secondhole 27 a, and the component detecting sensor 28 a configure anelectronic component detecting unit 24 a that detects the electroniccomponent P accommodated in the accommodation section 21 a of thecomponent supply tape 20, on the upstream side on the transport path 2from the component picking-up position 14. Similarly, the light source25, the first hole 27 b, and the sprocket hole detecting sensor 28 bconfigure a sprocket hole detecting unit 24 b that detects the sprockethole 21 b of the component supply tape 20 on the upstream side on thetransport path 2 from the component picking-up position 14. According tothe present embodiment, the electronic component detecting unit 24 a andthe sprocket hole detecting unit 24 b configure a single sensor unit 11.

Here, both the electronic component detecting unit 24 a and the sprockethole detecting unit 24 b are configured of an optical sensor thatincludes the shared light source 25 as the light-emitting section, andthe component detecting sensor 28 a and the sprocket hole detectingsensor 28 b as the light receiving section. That is, the sensor unit 11is configured to have the light source 25 in which an LED is used as asingle light source that emits light for detecting the sprocket hole andlight for detecting the electronic component and to have the componentdetecting sensor 28 a as the light receiving section for detecting theelectronic component and the sprocket hole detecting sensor 28 b as thelight receiving section for detecting the sprocket hole. In this manner,it is possible to realize a compact sensor unit 11 having a simplifiedconfiguration, which has both functions of the sprocket hole detectionand the electronic component detection.

Further, the optical sensor is configured to use the transmissivesensor; however, a reflective type sensor which receives reflected lightof the light radiating from the light emitting section, which isreflected from a detection target, as the inspection light, may be used.Further, as the sensor used as the electronic component detecting unit24 a, a magnetic detection type sensor that reacts to a metal portion ofthe electronic component P and outputs a detection signal may be usedinstead of the optical sensor.

According to the present embodiment, as illustrated in FIG. 3B, thesprocket hole detecting unit 24 b is disposed on the upstream side bythe predetermined offset dimension D from the electronic componentdetecting unit 24 a in the tape feeding direction. The employment ofsuch a configuration makes it possible to first detect the sprocket hole21 b, normally, of a pair of accommodation section 21 a and the sprockethole 21 b which are formed to be close to each other. The sprocket holedetection result is used as a reference and thereby, it is possible toreliably identify a detection signal corresponding to the subsequentaccommodation section 21 a and it is possible to perform efficient andhighly reliable detection of the presence or absence of the electroniccomponent P in the accommodation section 21 a. The sensor unit 11 may beused as the tape detecting sensor that detects the presence or thepassing of the component supply tape 20 on the transport path 2.

Next, with reference to FIG. 5, a correlation between the detectionsignals of the component detecting sensor 28 a and the sprocket holedetecting sensor 28 b in the sensor unit 11 will be described. In FIG.5, the output signals of the component detecting sensor 28 a and thesprocket hole detecting sensor 28 b are illustrated as waveforms usingtwo of upper and lower graphs, in which the horizontal axis is shared asthe time axis. In the lower graph corresponding to the output of thesprocket hole detecting sensor 28 b, the timings H1, H2, and H3 arrangedalong the horizontal axis which indicates a time series representingtimings at which the center of the sprocket hole 21 b passes thesprocket hole detecting sensor 28 b and the detection waveform Wdillustrated in FIG. 4B is acquired at each of the timings.

In the upper graph corresponding to the output of the componentdetecting sensor 28 a, timings P10, P15, P20, P25, and P30 arrangedalong the horizontal axis which indicates a time series representtimings at which the center of the accommodation section 21 a passes thecomponent detecting sensor 28 a and the detection waveform illustratedin FIG. 4A appears at each of the timings. As described above, thecomponent detecting sensor 28 a and the sprocket hole detecting sensor28 b have the positional relationship of being shifted by thepredetermined offset dimension D from each other in the tape feedingdirection. Hence, the detection waveform Wa of the accommodation section21 a adjacent to the sprocket hole 21 b appears after a detection delaytime T0 (T01 or T02) from the detection waveform Wd of the sprocket hole21 b.

Here, the sprocket holes 21 b are formed at regular pitches in thecomponent supply tape 20, however, practically, the component supplytape 20 does not always pass the sensor unit 11 in the tape feeder 1 ata regular speed, and variation is generated. In other words, since thecomponent supply tape 20 is fed in a tape feeding method in which thecomponent supply tape 20 is pushed from the upstream side to thedownstream side even when the feeding motor 3M is driven at a regularspeed, jamming is likely to occur, such as the component supply tape 20deformed in an undulated manner on the transport path 2 or partiallycrumpled component supply tape 20.

When such jamming occurs, the component supply tape 20 does not pass thesensor unit 11 at the regular speed. FIG. 5 illustrates an example inwhich the passing the intermediate sensor 10 is performed at a low speeddue to such jamming between the timings H1 and H2 and the passing isperformed at a high speed between the timings H2 and H3 because suchjamming is removed. In other words, even when the detection timing isdetermined in advance based on the driving by the feeding motor 3M,practically, the timing at which the accommodation section 21 a passesthe sensor unit 11 is highly likely to deviate from the predetermineddetection timing such that it is possible that false detection isperformed.

Thus, in the present embodiment, the timing at which the sprocket holes21 b formed in the component supply tape 20 at regular pitches pass thesensor unit 11 is detected, based on the timing, the detection waveformwhich is acquired when the accommodation section 21 a passes isidentified among the detection signals output from the componentdetecting sensor 28 a, and the presence or absence of the electroniccomponent P is determined based on the identified detection waveform.

According to the present embodiment, the sensor unit 11 described abovedetects the electronic component P in the accommodation section 21 a,with the component supply tape 20, which has yet to pass the cover-tapeprocessing unit 13 on the transport path 2, as the target. Therefore,posture stability in the accommodation section 21 a is ensured for theelectronic component P as the detecting target, due to the cover tape 22such that it is possible to achieve high reliability of the componentdetection. Further, a component detecting process is performed on theupstream side of the cover-tape processing unit 13 such that it ispossible to perform optical inspection without the influence of dust orthe like which is produced when the cover tape 22 is peeled off or cutopen.

Next, with reference to FIG. 7, a configuration and a processingfunction of the internal controller 15 in the tape feeder 1 will bedescribed. The controller 15 is connected to the transport motor 7M thatdrives the transport sprocket mechanism 7 and to the feeding motor 3Mthat drives the feeding sprocket 3 and controls the driving of themotors 7M and 3M. In addition, the controller 15 is connected to thecomponent detecting sensor 28 a, the sprocket hole detecting sensor 28b, the following-tape detecting sensor 8, the intermediate sensor 10,and the feeding sprocket sensor 3 a which configure the sensor unit 11,and receives the detection signals from the sensors. Further, thecontroller 15 is connected to a state displaying section 16 a and anoperation switch group 16 b which are provided on the operation/displaypanel 16 (refer to FIG. 1) such that the controller 15 controls adisplay process performed by the state displaying section 16 a, receivesan operation signal input through the operation switch group 16 b, andtransmits and receives a signal to and from the component mountingapparatus through a communication unit 40 which corresponds to acommunication interface.

The processing function of the controller 15 will be described. Thecontroller 15 internally includes a sensing information storage unit 30,a component presence/absence determining unit 31, a component depletiondetermining unit 32, a following-tape transport processing unit 33, afollowing-tape transfer processing unit 34, a slippage detectionprocessing unit 35, a heading-of-component processing unit 36, apreceding-tape transport processing unit 37, a preceding-tape dischargeprocessing unit 38, and a component presence/absence information storageunit 39.

The sensing information storage unit 30 stores sensing informationdetected by the component detecting sensor 28 a, the sprocket holedetecting sensor 28 b, the following-tape detecting sensor 8, theintermediate sensor 10, and the feeding sprocket sensor 3 a. Thecontroller 15 performs control processes of the units based on thesensing information stored in the sensing information storage unit 30.

The component presence/absence determining unit 31 determines thepresence or absence of the electronic component P in the accommodationsection 21 a based on information from the sprocket hole detecting unit24 b and information from the electronic component detecting unit 24 a.In other words, the component presence/absence determining unit 31identifies the information obtained from the electronic componentdetecting unit 24 a when the accommodation section 21 a passes theelectronic component detecting unit 24 a based on the information fromthe sprocket hole detecting unit 24 b, and, based on the identifiedinformation, determines the presence or absence of the electroniccomponent P in the accommodation section 21 a which has passed theelectronic component detecting unit.

In this manner, the information obtained when the accommodation section21 a passes the electronic component detecting unit 24 a is identifiedbased on the information from the sprocket hole detecting unit 24 b andthereby, it is possible to perform the component detection with highaccuracy without the influence of variation of the passing speed of thecomponent supply tape 20 on the transport path 2. Hence, in the tapefeeder 1 according to the present embodiment, the controller 15 controlsthe component supply tape transport unit (the feeding sprocket 3 and thetransport sprocket mechanism 7) described above based on thedetermination result of the component presence/absence determining unit31.

The component depletion determining unit 32 determines componentdepletion in the preceding tape 20 (1) based on the determination resultof the component presence/absence determining unit 31. In other words,when the determination result of the component presence/absencedetermining unit 31 indicates “absence” in one accommodation section 21a or “absence” consecutively a plurality of times, it is determined thatthe electronic components P are depleted in the preceding tape 20 (1).Based on the determination of the component depletion, the accommodationsection 21 a of the preceding tape 20 (1), in which the final componentPe (refer to FIG. 8) is accommodated, is identified and a preceding-tapedischarge instruction or a preceding-tape replacement instruction isoutput at a timing at which the final component Pe reaches the componentpicking-up position 14.

The following-tape transport processing unit 33 performs a process ofcausing the feeding sprocket 3 which corresponds to the inserted tapefeeding unit to transport the following tape 20 (2) inserted through theinsertion port 2 a. In other words, the following-tape transportprocessing unit 33 performs the process in which the leading end portion20 s of the following tape 20 (2) is fed to the following-tape stopper 9which means a standby position, the following tape 20 (2) is temporarilystopped, and the following tape 20 (2) is transported to a deliveryposition to the first sprocket 5 of the transport sprocket mechanism 7after the preceding tape 20 (1) is discharged.

In addition, after the tape detecting sensor such as the intermediatesensor 10 or the electronic component detecting unit 24 a of the sensorunit 11 detects that the terminal end portion 20 e of the preceding tape20 (1) passes, the following-tape transport processing unit 33 has afunction as a subsequent-tape transport unit which causes the feedingsprocket 3 to transport the subsequent tape 20 (2) on the transport path2 to a position at which the tape detecting sensor detects the tape. Inthis manner, after the passing of the preceding tape 20 (1), rapidtransport of the following tape 20 (2) makes it possible to advance acomponent supply start time of the subsequent tape and it is possible toreduce time loss due to a standby time of the component mountingapparatus. Here, as the tape detecting sensor for detecting the passingof the preceding tape 20 (1), the electronic component detecting unit 24a of the sensor unit 11 may be used.

The following-tape transfer processing unit 34 performs a process ofdelivering the leading end portion 20 s of the following tape 20 (2)transported through the process of the following-tape transportprocessing unit 33 after the depleted preceding tape 20 (1) isdischarged by the transport sprocket mechanism 7. In other words, thefollowing-tape transfer processing unit 34 corresponds to asubsequent-tape delivery unit that causes the feeding sprocket 3 totransport the following tape 20 (2) which is the subsequent componentsupply tape 20 on the transport path 2 and delivers the leading endportion 20 s of the following tape 20 (2) to the transport sprocketmechanism 7 which corresponds to the component supply tape transportingunit, after the transport sprocket mechanism 7 transports the depletedpreceding tape 20 (1).

The slippage detection processing unit 35 performs a process ofdetecting “slippage” occurring when the transport sprocket mechanism 7transports the following tape 20 (2). In other words, the slippagedetection processing unit 35 detects “slippage” which means tape feedingslippage occurring when the following tape 20 (2) which is fed by pitchby the feeding sprocket 3 is delivered to the transport sprocketmechanism 7. Here, “slippage” means abnormal tape feeding due to therotation of the first sprocket 5 in a state in which feeding claws ofthe first sprocket 5 do not normally engage with the sprocket holes 21 bin a tape feeding method in which the first sprocket 5 is caused torotate in a state in which the feeding claws engage with the sprocketholes 21 b formed in the base tape 21 at the regular pitch.

The heading-of-component processing unit 36 corrects the transport ofthe following tape 20 (2) by the transport sprocket mechanism 7 based onthe slippage detected by the slippage detection processing unit 35 andthereby, a heading-of-component process of positioning the leadingcomponent Ps in the following tape 20 (2) at the component picking-upposition 14 is performed.

The preceding-tape transport processing unit 37 performs a process ofsequentially transporting the electronic components P accommodated inthe accommodation sections 21 a to the component picking-up position 14by transporting the preceding tape 20 (1) by pitch, based on theinstruction from the component mounting apparatus. The preceding-tapedischarge processing unit 38 performs a process of discharging an emptytape part of the preceding tape 20 (1) through the discharge port 2 bafter the final component Pe of the preceding tape 20 (1) reaches thecomponent picking-up position 14. In other words, after the finalcomponent Pe (last electronic component) is picked up at the componentpicking-up position 14 after the component depletion determining unit 32determines depletion of the component, the preceding-tape dischargeprocessing unit 38 which corresponds to a tape discharge processing unitperforms a tape discharge process of causing the transport sprocketmechanism 7 to transport the depleted preceding tape 20 (1) through thedischarge port 2 b.

The tape discharge process is performed by driving the transportsprocket mechanism 7 until feeding amounts of the component supply tape20 by the transport sprocket mechanism 7 are accumulated to become apredetermined feeding amount after the passing of the terminal endportion 20 e of the preceding tape 20 (1) is detected by the tapedetecting sensor such as the intermediate sensor 10 or the electroniccomponent detecting unit 24 a of the sensor unit 11, which is disposedon the transport path 2.

The component presence/absence information storage unit 39 stores thepresence or absence of a component in the accommodation sections 21 a ofthe component supply tape 20, which is detected by the componentpresence/absence determining unit 31, that is, the accommodationsections 21 a present between the sensor unit 11 and the componentpicking-up position 14, for each accommodation section 21 a. In thepreceding-tape transport process by the preceding-tape transportprocessing unit 37, how many pitch feeding times the preceding tape 20(1) is fed are controlled based on the component presence/absenceinformation on each accommodation section 21 a, which is stored in thecomponent presence/absence information storage unit 39.

Next, a component presence/absence determining process will be describedwith reference to FIG. 6. The component presence/absence determinationis performed using a process function of the component presence/absencedetermining unit 31 (refer to FIG. 7) which is included in thecontroller 15. The component presence/absence determining unit 31identifies a range of the detection waveform corresponding to theaccommodation section 21 a of the output information on the componentdetecting sensor 28 a which is stored in the sensing information storageunit 30. Specifically, the timings H1 and H2 are detected using theoutput of the sprocket hole detecting sensor 28 b and timings T1 and T2obtained by a delay of standard delay time DT from the timings H1 and H2are determined. According to the present example, since theaccommodation sections 21 a are provided at a pitch which is half thepitch of the sprocket hole 21 b, the component presence/absencedetermining unit 31 equally divides a zone between the timings T1 to T2(first cycle) into two zones of a first zone A1 and a second zone A2with a time reference. The first zone A1 and the second zone A2correspond to the accommodation sections 21 a, one to one, and contain acontinuous detection waveform (hereinafter, referred to as a continuouswaveform) obtained between time points of immediately before theaccommodation sections 21 a corresponding to the zones A1 and A2 passthe component detecting sensor 28 a and immediately after the passing.

Next, the component presence/absence determining unit 31 evaluates theoutput of the component detecting sensor 28 a in the respective firstzone A1 and the second zone A2 and the presence or absence of acomponent in the accommodation section 21 a which has passed thecomponent detecting sensor 28 a is determined by determining whether theoutput corresponds to the detection waveform Wc. The determination isperformed in a method in which an evaluation parameter such as a meanvalue, an integrated value, or the like, of the detection waveform, iscompared to a preset threshold value based on a componentpresence/absence pattern illustrated in FIG. 4A, or the like. In thismanner, the component presence/absence determining unit 31 identifiesoutput information (detection waveform) obtained from the componentdetecting sensor 28 a, based on the information from the sprocket holedetecting sensor 28 b, when the accommodation section 21 a passes thecomponent detecting sensor 28 a and the presence or absence of theelectronic component in the passing accommodation section, based on theidentified output information.

The component presence/absence determining unit 31 also executes thesame process in a cycle from a second cycle S2 when the componentpresence/absence determining process is ended in a first cycle S1. Thestandard delay time DT used when the timings T1 and T2 are determined inthe component presence/absence determining process is used to adjust thetimings T1 and T2 such that the timings T1 and T2 are not overlapped inthe continuous waveform and the standard delay time DT does not have tobe necessarily used. For example, in a case where the offset dimension Dis set such that the component detecting sensor 28 a does not detect theaccommodation section 21 a but detects a portion of the component supplytape 20 when the sprocket hole detecting sensor 28 b detects the passingof the sprocket hole, the component presence/absence determining processmay be performed with the timings H1 and H2 as the timings T1 and T2without any delay.

Next, with reference to FIG. 8 and FIG. 9, the tape feeding operation ofthe component supply tape 20 in the tape feeder 1 will be described.Here, an electronic component supply method in which the componentsupply tape 20 illustrated in FIGS. 2A and 2B is inserted through theinsertion port 2 a of the transport path 2 and transported to thecomponent picking-up position 14 along the transport path 2 and theelectronic component P accommodated in the accommodation section 21 a issupplied to the component mounting apparatus is illustrated and aprocessing method of the component supply tape 20 in the tape feeder 1is illustrated.

(1) to (5) in FIG. 8 and (1) to (4) in FIG. 9 schematically illustrate asimplified series of tape feeding operations of the preceding tape 20(1) and the following tape 20 (2) which is additionally refilled to besubsequent to the preceding tape 20 (1) in the same tape feeder 1. Thepreceding tape 20 (1) and the following tape 20 (2) are discharged fromthe discharge port 2 b passing, from the upstream side, the feedingsprocket 3, the following-tape stopper 9 and the following-tapedetecting sensor 8, the intermediate sensor 10, the sensor unit 11, thefirst sprocket 5, and the component picking-up position 14, in thisorder. In such tape feeding, arrows by solid lines indicate a continuousfeeding transport operation in which the tape feeding of the componentsupply tape 20 is continuously performed and arrows by dotted linesindicate a pitch feeding transport operation in which the tape feedingof the component supply tape 20 is intermittently performed.

(1) in FIG. 8 illustrates a state in which an operator inserts thefollowing tape 20 (2) through the insertion port 2 a based on acomponent refilling instruction in a state in which the component supplyis continued by the pitch feeding (an arrow c) of the preceding tape 20(1) in the tape feeder 1. Here, the leading end portion 20 s of thefollowing tape 20 (2) is inserted to the downstream side passing thefeeding sprocket 3. In this manner, the feeding sprocket 3 rotates, thedriving of the feeding motor 3M is started by detecting of the rotationby the feeding sprocket sensor 3 a, and the transport of the followingtape 20 (2) is performed.

As illustrated in (2) in FIG. 8, the leading end portion 20 s of thefollowing tape 20 (2) reaches the following-tape stopper 9 and thefollowing-tape detecting sensor 8 detects the following tape 20 (2) andthereby, the driving of the feeding motor 3M is stopped and thefollowing tape 20 (2) is stopped. Then, the following tape 20 (2) waitsat the position when the terminal end portion 20 e of the preceding tape20 (1) which is repetitively fed by pitch (an arrow d) passes theintermediate sensor 10. The operation illustrated in (1) and (2) in FIG.8 described above corresponds to a following-tape preparing step inwhich the subsequently refilled following tape 20 (2) is prepared in apitch feeding process of the preceding tape 20 (1).

The following-tape preparing step is executed by controlling therespective units by the following-tape transport processing unit 33(refer to FIG. 7). In other words, after the intermediate sensor 10which is the tape detecting sensor detects the passing of the terminalend portion 20 e of the preceding component supply tape 20 (precedingtape 20 (1)), the following-tape transport processing unit 33 functionsas a subsequent-tape transport unit that causes the feeding sprocket 3to transport the following tape 20 (2) which is the subsequent componentsupply tape 20 to a position which is detected by the intermediatesensor 10, on the transport path 2.

Then, as illustrated in (3) and (4) in FIG. 8, the preceding tape 20 (1)is further fed (arrows e and f) by pitch. In other words, the transportsprocket mechanism 7 positions the preceding tape 20 (1) through pitchfeeding of the preceding tape 20 (1) and through transporting theaccommodation sections 21 a in which the electronic components P isaccommodated to the component picking-up position 14 in order, based onthe instruction from the component mounting apparatus (accommodationsection positioning step). Then, the intermediate sensor 10 as the tapedetecting sensor on the transport path 2 detects the passing of theterminal end portion 20 e of the preceding tape 20 (1) (passingdetection step).

After the passing detection step, as illustrated in (4) in FIG. 8, thefeeding sprocket 3 which corresponds to the inserted tape feeding unitcontinuously feeds and transports (an arrow g) to a position at whichthe intermediate sensor 10 can detect the subsequent tape 20 (2) on thetransport path 2. When the intermediate sensor 10 detects the followingtape 20 (2), the feeding motor 3M is stopped and the following tape 20(2) waits at the position.

In the pitch feeding of the preceding tape 20 (1) illustrated in (2) and(3) in FIG. 8, the component presence/absence determining unit 31performs the presence or absence determination of the electroniccomponent P in the accommodation section 21 a passing the sensor unit11, using the output from the sensor unit 11. The componentpresence/absence determination result is stored as the componentpresence/absence information in association with the respectiveaccommodation sections 21 a in the component presence/absenceinformation storage unit 39. The component depletion determination, theheading-of-component process, and the tape discharge process to bedescribed below are executed based on the component presence/absenceinformation stored in the component presence/absence information storageunit 39.

In a case where the component presence/absence determining unit 31determines “absence” with respect to one accommodation section 21 a, or“absence” consecutively, the controller 15 determines that the finalcomponent Pe is accommodated in the accommodation section 21 a which isdetermined as “presence” at the last time. That is, the final componentPe which means the final electronic component P is detected on theupstream side from the component picking-up position 14 on the transportpath 2 (final component detecting step). During the detecting process,calculation is performed of how many times the pitch feeding isperformed (final component pitch feeding times) until the finalcomponent Pe reaches the component picking-up position 14. Hence, whenthe tape feeding of the preceding tape 20 (1) is performed, subtractionof the final component pitch feeding times is performed whenever thepitch feeding is performed.

(4) in FIG. 8 illustrates a state in which the final component pitchfeeding times become zero and the final component Pe reaches thecomponent picking-up position 14 in the tape feeding of the precedingtape 20 (1). In this state, the controller 15 notifies the componentmounting apparatus that the final component Pe is detected (detectionnotifying step). After the mounting head picks up the final componentPe, at the component picking-up position 14, the component mountingapparatus that receives the notification outputs an instruction, to thetape feeder 1, that the final component Pe has been formed such thatthere is a need to perform the preceding-tape discharge or thepreceding-tape replacement. In other words, the tape feeder 1 receives anotification indicating that the final component Pe has been picked upfrom the component mounting apparatus (picking-up notification receivingstep).

The operations illustrated in (3) and (4) in FIG. 8 correspond to apreceding-tape pitch feeding step in which the preceding tape 20 (1) isfed by pitch, the sensor unit 11 performs the component presence/absencedetection, and the pitch feeding is repetitively executed until thefinal component Pe reaches the component picking-up position 14. Then,the preceding-tape pitch feeding step is executed by controlling therespective units by the preceding-tape transport processing unit 37(refer to FIG. 7).

When the picking-up notification is received, the preceding-tapedischarge processing unit 38 controls the respective units and therebyan empty tape discharge step to be described below is executed such thatthe depleted preceding tape 20 (1) is discharged after the finalcomponent Pe is picked up. In the empty tape discharge step, thetransport sprocket mechanism 7 is driven until feeding amounts by thetransport sprocket mechanism 7 are accumulated to become thepredetermined feeding amount required for the discharge of the emptytape after the passing detection step in which the passing of theterminal end portion 20 e of the preceding tape 20 (1) is detected onthe transport path 2. Here, in a stage in which the final component Pereaches the component picking-up position 14, there are two cases inempty tape discharge modes depending on whether or not the intermediatesensor 10 disposed on the transport path 2 already detects the passingof the terminal end portion 20 e of the preceding tape 20 (1).

First, in the case (case 1) where the passing of the terminal endportion 20 e is already detected, a tape feeding amount (driving time ofthe transport motor 7M, an encoder pulse amount, pitch feeding times, orthe like) required for the preceding tape 20 (1) to be transported fromthe position of the intermediate sensor 10 to the discharge port 2 b isalready found out. In this case, the preceding-tape discharge processingunit 38 calculates the predetermined tape feeding amount required forthe preceding tape 20 (1) to be discharged using the timing at which thepreceding tape 20 (1) passes the intermediate sensor 10 and the tapefeeding amount required for the final component Pe to reach thecomponent picking-up position 14 from the timing, and the preceding-tapedischarge processing unit 38 drives the transport motor 7M by the tapefeeding amount. That is, the transport motor 7M is driven until feedingamounts by the transport sprocket mechanism 7 after the passingdetection step are accumulated to become the predetermined feedingamount described above. In this manner, after the final component Pe ispicked up, the depleted preceding tape 20 (1) is discharged (an arrow h)from the discharge port 2 b through the continuous feeding transport.

Meanwhile, in a stage in which the final component Pe reaches thecomponent picking-up position 14 and in the case (case 2) in which thepassing of the terminal end portion 20 e has yet to be detected, thetransport motor 7M is driven as is and the discharge of the precedingtape 20 (1) is started (empty tape discharge step). In the empty tapedischarge step, when the intermediate sensor 10 detects the passing ofthe terminal end portion 20 e (passing detection step), thepredetermined feeding amount required for tape feeding of the precedingtape 20 (1) from the position of the intermediate sensor 10 to thedischarge port 2 b is calculated after the passing detection step andthe transport motor 7M is driven by the tape feeding. In this manner,after the final component Pe is picked up, the depleted preceding tape20 (1) is discharged from the discharge port 2 b through the continuousfeeding transport.

In both cases, after the final component Pe is picked up, it is possibleto start the rapid discharge of the empty tape and, further, tosignificantly shorten the period of the driving time of the transportsprocket mechanism 7, which is required for the empty tape discharge.Particularly, in the case (case 1), at a time point at which thecomponent depletion determining unit 32 determines the componentdepletion, since a part of the predetermined feeding amount describedabove is already removed, it is possible to shorten the period of timerequired for the empty tape discharge.

When the terminal end portion 20 e of the preceding tape 20 (1) passesthe intermediate sensor 10, the feeding motor 3M is driven and thetransport of the following tape 20 (2) is started. As illustrated in (4)in FIG. 8, when the intermediate sensor 10 detects the leading endportion 20 s of the following tape 20 (2), the feeding motor 3M isstopped and the following tape 20 (2) waits at the position. Next, asillustrated in (5) in FIG. 8 and (1) in FIG. 9, the terminal end portion20 e of the preceding tape 20 (1) passes the sensor unit 11, the feedingmotor 3M is driven and the transport (an arrow i) of the following tape20 (2) is started through the continuous feeding. When the sensor unit11 detects the leading end portion 20 s of the following tape 20 (2),the feeding motor 3M is stopped. At this timing, the detection of theleading component Ps passing the sensor unit 11 is started.

When the discharge (an arrow j) of the preceding tape 20 (1) iscompleted in (1) in FIG. 9, the following tape 20 (2) is transported (anarrow k) through the continuous feeding and a following-tape transferprocess of causing the following tape 20 (2) to engage with the firstsprocket 5 of the transport sprocket mechanism 7 and of transferring thefollowing tape 20 (2) is started. First, the feeding motor 3M is drivenand the following tape 20 (2) is transported (an arrow l) through thecontinuous feeding until the leading end portion 20 s approaches thevicinity of the first sprocket 5 as illustrated in (2) in FIG. 9.

Next, when the leading end portion 20 s approaches the vicinity of thefirst sprocket 5, the tape feeding operation of the feeding motor 3M ischanged to the pitch feeding (an arrow m) and the tape feeding operationof the transport motor 7M that drives the first sprocket 5 is alsochanged to the pitch feeding as illustrated in (3) in FIG. 9. At thattime, both counting of pitch transport times K1 of the transport motor7M and counting of the number K2 of the sprocket holes 21 b which havepassed the sprocket hole detecting sensor 28 b are started. The pitchtransport of the feeding motor 3M is stopped at a timing at which it isconsidered that the leading end portion 20 s of the following tape 20(2) passes the first sprocket 5 and then, only the transport motor 7M isdriven and performs the tape transport (an arrow n) through the pitchfeeding of the following tape 20 (2).

The leading end portion 20 s of the following tape 20 (2) passes thecomponent picking-up position 14, the leading component Ps reaches thecomponent picking-up position 14 as illustrated in (4) in FIG. 9 andthereby, the heading of the following tape 20 (2) is completed. Then,the leading component Ps is picked up by the mounting head of thecomponent mounting apparatus and then, the picking-up of the componentfrom the following tape 20 (2) as a target is started. In the tapefeeding operation described above, an example is described, in which theintermediate sensor 10 is used as the tape detecting sensor that detectsthe passing of the terminal end portion 20 e of the preceding tape 20(1), however, the electronic component detecting unit 24 a of the sensorunit 11 may be used as the tape detecting sensor.

In the tape feeder 1 according to the present embodiment as describedabove, in the process of the component supply tape 20 in which thecomponent supply tape transport unit transports the component supplytape 20 having the accommodation section 21 a in which the electroniccomponent P is accommodated, to the component picking-up position 14, itis determined that the electronic components P are depleted in thecomponent supply tape 20 based on the determination result obtainedafter the detection of the electronic component P is performed on theupstream side from the component picking-up position 14 on the transportpath 2 such that the presence or absence of the electronic component Pin the accommodation section 21 a is determined. After the finalcomponent Pe is picked up at the component picking-up position 14 afterthe determination of the depletion of the electronic component P, thetape discharge process is performed, in which the component supply tapetransport unit transports the depleted preceding tape 20 (1) to thedischarge port 2 b. In this manner, the depleted preceding tape 20 (1)after the electronic components P are picked up is rapidly dischargedsuch that it is possible to significantly reduce the period of time towait during supply of the subsequent tape 20 (2) and it is possible toimprove productivity.

An electronic component supply apparatus and a method of processing thecomponent supply tape in the electronic component supply apparatus ofthe embodiments are effective in that it is possible to rapidlydischarge a depleted component supply tape after electronic componentsare picked up to improve productivity and are applicable in a componentmounting field in which an electronic component is mounted on asubstrate.

What is claimed is:
 1. An electronic component supply apparatus thattransports a component supply tape having a plurality of accommodationsections in which electronic components are accommodated and thatsupplies each of the electronic components accommodated in each of theaccommodation sections to a component mounting apparatus, the electroniccomponent supply apparatus comprising: a main body unit which isprovided with a transport path that guides the component supply tapefrom an insertion port, into which the component supply tape isinserted, to a discharge port, through which the component supply tapeis discharged; an inserted tape feeding unit that transports thecomponent supply tape transported along the transport path toward thedischarge port along the transport path; a component supply tapetransport unit that transports by pitch the component supply tapeinserted through the insertion port toward the discharge port, andpositions the accommodation section at the component picking-up positionon an upstream side from the discharge port; an electronic componentdetecting unit that detects the electronic component accommodated in theaccommodation section on the upstream side from the component picking-upposition on the transport path; a component presence/absence determiningunit that determines presence or absence of the electronic component inthe accommodation section based on information from the electroniccomponent detecting unit; a component depletion determining unit thatdetermines that the electronic components are depleted in the componentsupply tape when a determination result of the componentpresence/absence determining unit is “absence” or determination resultsof the component presence/absence determining unit are “absence” aplurality of consecutive times; a tape discharge processing unit thatcauses the component supply tape transport unit to transport thedepleted component supply tape to the discharge port through continuousfeeding transport after a final component is picked up at the componentpicking-up position after the component depletion determining unitdetermines component depletion; and a subsequent-tape delivery unit thatcauses the inserted tape feeding unit to transport a subsequentcomponent supply tape on the transport path and that delivers a leadingend portion of the subsequent component supply tape to the componentsupply tape transport unit.
 2. The electronic component supply apparatusaccording to claim 1, further comprising: a tape detecting sensordisposed on the transport path, wherein the tape discharge processingunit drives the component supply tape transport unit until feedingamounts by the component supply tape transport unit are accumulated tobecome a predetermined feeding amount after the tape detecting sensordetects passing of the terminal end portion of the component supplytape.
 3. The electronic component supply apparatus according to claim 2,further comprising: a subsequent-tape transport unit that causes theinserted tape feeding unit to transport the subsequent component supplytape on the transport path to a position at which the tape detectingsensor detects the tape after the tape detecting sensor detects thepassing of the terminal end portion of the component supply tape.
 4. Theelectronic component supply apparatus according to claim 2, wherein thetape detecting sensor corresponds to the electronic component detectingunit.
 5. A method of processing a component supply tape in theelectronic component supply apparatus according to claim 1 that inserts,through the insertion port of the transport path, the component supplytape, that transports the component supply tape along the transport pathto the component picking-up position provided on the transport path, andthat supplies each of the electronic components accommodated in each ofthe accommodation sections to the component mounting apparatus, themethod comprising: sequentially positioning the accommodation sectionsat the component picking-up position by the component supply tapetransport unit; detecting a final electronic component on the upstreamside from the component picking-up position on the transport path;notifying the component mounting apparatus that the final electroniccomponent is detected; receiving, from the component mounting apparatus,a notification that the final electronic component is picked up; anddischarging the depleted component supply tape by the component supplytape transport unit when the notification is received from the componentmounting apparatus.
 6. The method according to claim 5, furthercomprising: detecting passing of the terminal end portion of thecomponent supply tape on the transport path, wherein, in the dischargingof the depleted component supply tape, the component supply tapetransport unit is driven until feeding amounts by the component supplytape transport unit are accumulated to become a predetermined feedingamount after the passing detection.
 7. The method according to claim 5,further comprising: transporting a subsequent component supply tape onthe transport path to the inserted tape feeding unit and delivering aleading end portion of the subsequent component supply tape to thecomponent supply tape transport unit after the discharging of thedepleted component supply tape.
 8. A method of processing a componentsupply tape in the electronic component supply apparatus according toclaim 1 that inserts, through the insertion port of the transport path,the component supply tape, that transports the component supply tapealong the transport path to the component picking-up position providedon the transport path, and that supplies each of the electroniccomponents accommodated in each of the accommodation sections to thecomponent mounting apparatus, the method comprising: sequentiallypositioning the accommodation sections at the component picking-upposition by the component supply tape transport unit; detecting passingof a terminal end portion of the component supply tape on the upstreamside from the component picking-up position on the transport path;detecting a final electronic component on the transport path after thepassing detection; notifying the component mounting apparatus that thefinal electronic component is detected; receiving, from the componentmounting apparatus, a notification that the final electronic componentis picked up; and discharging the depleted component supply tape by thecomponent supply tape transport unit when the notification is receivedfrom the component mounting apparatus, wherein, in the discharging ofthe depleted component supply tape, the component supply tape transportunit is driven until feeding amounts by the component supply tapetransport unit are accumulated to become a predetermined feeding amountafter the passing detection.
 9. A method of processing a componentsupply tape in the electronic component supply apparatus according toclaim 1 that inserts, through the insertion port of the transport path,the component supply tape, that transports the component supply tapealong the transport path to the component picking-up position providedon the transport path, and that supplies each of the electroniccomponents accommodated in each of the accommodation sections to thecomponent mounting apparatus, the method comprising: sequentiallypositioning the accommodation sections at the component picking-upposition by the component supply tape transport unit; detecting a finalelectronic component on the transport path, particularly, on theupstream side from the component picking-up position on the transportpath; notifying the component mounting apparatus that the finalelectronic component is detected; receiving, from the component mountingapparatus, a notification that the final electronic component is pickedup; discharging the depleted component supply tape by the componentsupply tape transport unit when the notification is received from thecomponent mounting apparatus; and detecting passing of a terminal endportion of the component supply tape in the discharging of the depletedcomponent supply tape, wherein, in the discharging of the depletedcomponent supply tape, the component supply tape transport unit isdriven until feeding amounts by the component supply tape transport unitare accumulated to become a predetermined feeding amount after thepassing detection.